Low Cost Halogen-Free Materials for Printed Wiring Board

Optical interconnect on printed wiring board

Integration of high-speed parallel optical interconnects into printed wiring boards (PWB) is studied. The aim is a hybrid optical–electrical board including both electrical wiring and embedded polymer waveguides. Robust optical coupling between the waveguide and the emitter/detector should be achieved by the use of automated pick-and-place assembly. Different coupling schemes were analyzed by c...

The state of the art in printed wiring board inspection

Automated visual inspection of printed wiring is providing research opportunities in completely utomated optical systems technology. This paper addresses device design considerations, articularly the important problem of turning an optical inspection device into a tool for lanufacturing process analysis and control.

Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections

When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder interconnections become multicomponent alloy systems whose microstructures cannot be predicted on the basis of the SnPb metallurgy. To better understand the influences of these microstructures on the reliability of lead-free electronics assemblies, SnAgCu-bumped components were...

MULTI-PRIDE: a system for supporting multi-layered printed wiring board design

The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modi cation of wiring and compaction, and (iv) routing on inside layers.

Ultra-Low-Cost Printed Electronics